The Interface Revolution: Bringing NVMe Performance to the MicroSD Form Factor

Update on Jan. 24, 2026, 7:09 p.m.

For over a decade, the microSD card has been defined by the UHS (Ultra High Speed) bus interface. While reliable, this legacy architecture has hit a physical wall. The UHS-I bus tops out at 104 MB/s, and even the dual-row UHS-II standard struggles to exceed 312 MB/s in real-world scenarios. As mobile devices and gaming consoles like the Nintendo Switch 2 demand SSD-level performance, a paradigm shift was required.

This shift is the microSD Express standard. It represents not just an evolution, but a complete replacement of the underlying communication language. By grafting the PCIe (Peripheral Component Interconnect Express) interface—the same technology found in desktop graphics cards and NVMe SSDs—onto a thumbnail-sized card, engineers have shattered the bandwidth ceiling. The Samsung P9 Express serves as a prime example of this architectural leap, delivering sequential read speeds of up to 800 MB/s by leveraging the NVMe protocol over a PCIe Gen 3.0 x1 lane.

800MB/s Speed Benchmark

The Architecture Shift: From SD Bus to PCIe

Traditional SD cards operate on a parallel bus architecture that is inherently limited by signal interference and clock synchronization at high speeds. The breakthrough of the microSD Express standard, utilized in the P9 Express, is the adoption of a Serial Bus Architecture via PCIe.

PCIe uses differential signaling, where data is sent over pairs of wires (lanes) with opposite voltages. This method is highly resistant to noise, allowing for much higher frequencies and data rates. Specifically, the P9 Express uses a single lane (x1) of PCIe Gen 3.0. This configuration provides a theoretical unidirectional bandwidth of roughly 985 MB/s. By moving to this serial interface, the card behaves less like a “memory card” and more like a removable SSD, allowing the host device to access data with significantly lower latency.

Pin Layout Physics: The Dual-Row Solution

Implementing PCIe on a microSD card presented a geometric challenge: how to add the necessary pins without breaking compatibility with billions of existing devices. The engineering solution is a specific Dual-Row Pin Layout.

  1. First Row (Legacy): The standard pins found on any microSD card remain unchanged. These carry the UHS-I signals (VDD, VSS, CLK, CMD, DAT0-3). This ensures that if you plug a P9 Express into an old camera or Switch 1, it functions perfectly as a standard UHS-I card (albeit at slower speeds).
  2. Second Row (Express): Located slightly behind the first row, these new pins are dedicated to the PCIe interface (Reference Clock, Transmit/Receive Differential Pairs).

When inserted into a compatible host (like the Nintendo Switch 2), the device detects the presence of the second row and negotiates a switch to PCIe mode. If the host lacks these pins, the card simply defaults to the legacy UHS-I mode. This “backward compatibility by design” is a critical feature of the transition period.

MicroSD Express Pin Layout

NVMe Protocol: Speaking the Language of SSDs

Hardware is only half the story. The software protocol used to manage data flow is equally important. Traditional cards use the SD Protocol, which was designed for simple file storage. The P9 Express utilizes NVMe (Non-Volatile Memory Express).

NVMe is designed specifically for flash memory. It supports massive queue depths (up to 64K commands per queue), whereas the SD Protocol handles one command at a time. This allows the P9 Express to handle multiple simultaneous read/write requests—crucial for modern gaming where an engine might be loading textures, audio, and physics data all at once. The combination of the PCIe highway and the NVMe traffic controller is what enables the 4x performance jump over standard cards.

Future Outlook

The release of cards like the P9 Express signals the beginning of the “Removable SSD” era. Future iterations will likely adopt PCIe Gen 4.0, doubling the bandwidth again to nearly 2 GB/s. However, this will necessitate even more advanced thermal management solutions, as pushing this much data through such a small surface area generates significant heat density.